international micro industries (imi) offers state of the art wafer bumping and wafer level packaging wlp contract services via high aspect ratio, high precision electroplating and photolithography technology. imi offers complete solutions; wafers from received from the fabricator, bumped by imi, then sent directly to our clients in the advanced chip packaging, medical, automotive, sensor, rfid and mems industries world-wide.
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公司地址:
1951 Old Cuthbert Road - Building 404,HADDONFIELD,NJ,USA